Chip Quik SMD1 Removal Kit vendor_BRADY Meets ATSM D6319 for medical

Meets ATSM D6319 for medical Exam use

Part Number: 851517

1 x Bonding Station 230 VAC

Brady Material: B-422 Permanent Polyester

ES1611* 12 oz / 340 g aerosol

Chip Quik SMD1 Removal Kit vendor_BRADY Meets ATSM D6319 for medicalOverview Easily remove SMD parts with Chip Quik removal alloy Reduce heat and reduce damage to circuit boards and SMD parts during removal Comes with SMD291 flux Features Fast, safe, and easy to use Removes QFP's, PLCC's, SOIC's and chip components under 150 c (300 F) temperature range No expensive tips or nozzles No damage to PC board or adjacent components Specifications Alloy: Chip Quik Flux Type: No Clean Flux Classification: REL0 Melting Point: