Desco 12250 Statfree® High Density Foam, 6.4mm x 610mm x 914mm March Specials 4mm Snap Stud

4mm Snap Stud

It contains high-temperature resistant compounds that protect component-free areas during wave soldering

Item model number T3711 11

CHANNELLOCK ® GL6 6

Dimensions Dimensions Small: 15

Desco 12250 Statfree® High Density Foam, 6.4mm x 610mm x 914mm March Specials 4mm Snap StudOverview High Density Foam is ideal for lead insertion packaging, providing ESD and physical protection to component leads, and bringing terminals to equipotential, minimizing exposure to discharge. Size: 24" x 36" Volume Resistivity: 10E3 10E5 ohms Surface Resistivity: 10E3 10E5 ohms Features Antistatic, low tribocharging Minimizes charge generation; material will conduct charges if grounded Dissipative corrosion resistant Ideal for long term storage